Vietnams Mb Bank To Sell 49% Of Cambodia Unit To Shinsei
Figure 7 compares the detailed organizations of existing 3D-stacked DRAM , where all layers share all TSVs, and a 3D-stacked DRAM using Dedicated-IO . TSVs provide two major benefits to increase memory bandwidth and energy efficiency. First, due to the small feature size of modern TSV technologies (10 − 35µm pitch for TSVs vs. 90µm […]
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